Pelican Packaging,Inc.
1806 Ord Way
Oceanside, Ca 92056
USA

(760) 438-6100
(760) 438-6100 Fax

© 2000-2014
All rights reserved

Die Processing:


PROCESS:

Vision:


- Ink Dot Detection
- Surface Inspection
- 2-D Ball Inspection

Electrical Test

Packaging:

- Tape
Embossed Tape
Paper Tape
Surf Tape
Sticky Tape

- Waffle Pack (2" x 2" or 4" x 4")

- Gel-Pak

- Wafer Rebuild (up to 300mm)

Final Visual Inspection


Components:

- CSP
- Bar Die
- QFN
- MLF

Wafers Size:
Up to 12 Inch

Die Size:
0.5 x 0.5mm to 25.4 x 25.4mm


(click photos for larger image)



World Leader in
Tape and Reel
Services



Capacity of 2 billion components per year



Complete ESD protection



Vision and Test capability available
Ink Dot Detection
Surface Inspection
2-D Ball Inspection