Pelican Packaging,Inc.
1806 Ord Way
Oceanside, Ca 92056
USA

(760) 438-6100
(760) 438-6100 Fax

© 2000-2014
All rights reserved

Electrical Test:



Wafer-Test-Tape:

Dicing, handling, picking, and flipping and other packaging operations can alter the IC performance. Therefore, it is necessary to test each individual IC again just before the tape and reel process. The test interface will consist of a test socket or contactor, an interface
board, and a frame, also referred to as a test head adapter. Our ability to process a final test as a last operation before tape and reel is what sets us apart from other companies which only process test at the wafer level.




Tape-Test-Tape:

Nobody likes to trash parts due to potential bad components in tape. Our ability to retest from tape to tape allows you to guarantee 100% good parts in tape.


World Leader in
Tape and Reel
Services



Capacity of 2 billion components per year



Complete ESD protection



Vision and Test capability available
Ink Dot Detection
Surface Inspection
2-D Ball Inspection