Pelican Packaging,Inc.
1806 Ord Way
Oceanside, Ca 92056
USA

(760) 438-6100
(760) 438-6100 Fax

© 2000-2014
All rights reserved

Wafer Processing:




Incoming Inspection

Wafer Marking

Wafer Mounting

Wafer Dicing

Wafer Cleaning






Wafer Marking:

-- Marking of backside silicon wafers facilitates traceabilities of semi-conductor devices

-- Marking is miniaturized and have no negative influence on the devices

-- Chip miniaturization marking is possible with accuracy at 50um



Wafer Dicing:

-- On-line blade load monitoring system ensures high quality cut

-- An intelligent blade wear curve learning system automatically compensates for blade wear

-- Close loop control for ultimate cut quality

-- Robust platform supports the most demanding applications



(click photos for larger image)











World Leader in
Tape and Reel
Services



Capacity of 2 billion components per year



Complete ESD protection



Vision and Test capability available
Ink Dot Detection
Surface Inspection
2-D Ball Inspection