WLCSP

Wafer level chip scale packaging

Wafer to tape

  • Electrical test
  • Wafer inspection before pick
  • Side wall inspection
  • Active side inspection
  • Mark side inspection

Standard Process

Wafer to tape and reel machine for Wafer Level Chip Scale Packaging (WLCSP)
  • Up to 12 inch wafers
  • Die size down to 0.3X0.5 mm
  • Ultra thin components to 0.05 mm thick
  • Ultra accurate direct linear servo motors
  • Vision position correction

Quality ASSURANCE

100% automated final inspection tape to tape machine.
  • 30 years experience
  • Mature process oriented around FMEA
  • Statistical process control
  • Integrated 6S inspection and electrical test available
  • 100% automated final vision inspection
Pelican Packaging

1806 Ord Way
Oceanside, CA 92056

sales@pelicanpackaging.com

760-438-6100

WE are here to help!
World Leader in Tape and Reel ServicesCapacity of 2 billion components per yearComplete ESD protectionVision and test capability available
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